Sawing & Polishing of Samples
The SPU 60 Saw & Polishing Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others.
Powerful & Precise
The SPU 60 processes wire up to 60 mm² (AWG 1/0) or a crimp height of 23 mm (0.91"). It is ideally suited for a wide range of applications including processing of smaller contacts.
| >> |
virtual demo: |
 3.7 MB |
 4 MB |
Each connection to be tested (= test sample) is secured in a sample holder that can be inserted easily into the saw & polishing unit (SPU) using a tool-less, quick-change mechanism. Sawing (cutting) and polishing processes are combined in one unit which saves time compared to separate units. Test samples can be prepared in one step without having to remove the sample holder.
 |
 |
Cutting surface -
not polished |
Cutting surface - polished |
The SPU 60 already achieves an excellent cutting surface prior to polishing which can further be optimized using different sawing blades for different materials or small wires down to 0.3 mm².
Take the product tour for additional information of the SPU 60 Saw & Polishing Unit such as technical specifications.
|